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Part Number
MA46H120
GaAs Constant Gamma FlipChip Varactor Diode
Features
* * * * * * Constant Gamma for Linear Tuning Low Parasitic Capacitance High Q Silicon Nitride Passivation Polyimide Scratch Protection Surface Mount Configuration
Chip Layout
TOP VIEW
Description
M/A-COM's MA46H120 is a gallium arsenide flip chip hyperabrupt varactor diode. These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. The MA46H120 diodes are fully passivated with silicon nitride and have an additional layer of polyimide for scratch protection. The protective coatings prevent damage to the junction during automated or manual handling. The flip chip configuration is suitable for pick and place insertion.
BOTTOM VIEW
Applications
The MA46H120 hyperabrupt GaAs tuning varactor is designed for wide bandwidth VCOs and voltage tuned filters where large capacitance change versus tuning voltage and high Q are required. With a constant gamma of 1.0, these diodes are particularly useful where highly predictable frequency tuning is required.
Electrical Specifications @ T A = +25 C
Breakdown Voltage @ IR = 10 A, VB = 15V Minimum
CT (pF) f=1MHz, VR=0V Min MA46H120 Typ 1.1 Max CT (pF) f=1MHz, VR=4V Min 0.30 Typ Max 0.40 CT (pF) f=1MHz, VR=10V Min 0.14 Typ Max 0.20 f=50MHz, VR=4V Min 3000 Typ Max Min 0.9 VR=2-12V Typ Max 1.1 Q Factor Gamma
V3.00
M/A-COM Division Of AMP Incorporated n North America: Tel. (800) 366-2266, Fax (800) 618-8883 n Asia/Pacific: Tel. +85 2 2111 8088, Fax +85 2 2111 8087 n Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020 www.macom.com AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice.
GaAs Constant Gamma Flip-Chip Varactor Diode
MA46H120
Chip Outline Drawing
(ODS-1203)
Typical Performance Curve
CAPACITANCE vs VOLTAGE Gamma = 1.0 10% from 2 - 12 Volts
TOTAL CAPACITANCE (pF) 1
0.1 1 10 REVERSE VOLTAGE (V) 100
INCHES DIM A B C D E F MIN .025 .012 .006 .007 .004 .018 MAX .027 .015 .008 .009 .006 .020 MIN .64 .32 .15 .17 .10 .45
MM MAX .69 .37 .20 .22 .15 .50
Absolute Maximum Ratings1
Parameter Operating Temperature Storage Temperature Power Dissipation Mounting Temperature Maximum Ratings -40C to +125C -65C to +150C 100 mW +235C for 10 seconds
1. Exceeding these limits may cause permanent damage.
Mounting Techniques
These chips were designed to be inserted onto hard or soft substrates with the junction side down. They can be mounted with conductive epoxy or with a low temperature solder preform. The die can also be assembled with the junction side up, and wire or ribbon bonds made to the pads.
Handling Procedures
The following precautions should be observed to avoid damaging GaAs Flip-Chips:
Cleanliness
These chips should be handled in a clean environment. Do not attempt to clean die after installation.
Solder Die Attachment
Solder which does not scavenge gold, such as Indalloy #2, is recommended. Sn-Pb based solders are not recommended due to solder embrittlement. Do not expose die to a temperature greater than 235C, or greater than 200C for longer than 10 seconds. No more than three seconds of scrub should be required for attachment.
Static Sensitivity
Varactor diodes are ESD sensitive and can be damaged by static electricity. Proper ESD techniques should be followed to when handling these devices.
General Handling
The protective polymer coating on the active areas of these dice provides scratch protection, particularly for the metal airbridge which contacts the anode. Dice can be handled with tweezers or vacuum pickups and are suitable for use with automatic pick-and-place equipment.
Epoxy Die Attachment
Assembly can be preheated to 125 - 150C. Use a minimum amount of epoxy. Cure epoxy per manufacturer's schedule. For extended cure times, temperatures must be kept below 200C.
V3.00
M/A-COM Division Of AMP Incorporated n North America: Tel. (800) 366-2266, Fax (800) 618-8883 n Asia/Pacific: Tel. +85 2 2111 8088, Fax +85 2 2111 8087 n Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020 www.macom.com AMP and Connecting at a Higher Level are trademarks. Specifications subject to change without notice.

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